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| CXG1090EN High Power 2 x 4 Antenna Switch MMIC with Integrated Control Logic Description The CXG1090EN is a high power antenna switch MMIC. This IC is suited to connect Tx/Rx to one of 4 antennas in cellular handset such as PDC. The CXG1090EN has the integrated control logic and can be operated with CMOS input. This IC is designed using the Sony's GaAs J-FET process which enable the CXG1090EN to be operated with low voltage. Features * Low insertion loss: 0.30dB (Typ.)@900MHz, 0.40dB (Typ.)@1.5GHz * Small package: 16-pin VSON * High power handling: Pl dB: 37dBm * CMOS compatible input control * Low bias voltage: VDD = 3.0V Applications 2 x 4 antenna switch for digital cellular telephones such as PDC handsets Structure GaAs J-FET MMIC Absolute Maximum Ratings * Bias voltage VDD * Control voltage VCTL * Operating temperature Topr * Storage temperature Tstg 16 pin VSON (Plastic) 7 5 -35 to +85 -65 to +150 V @Ta = 25C V @Ta = 25C C C Note on Handling GaAs MMICs are ESD sensitive devices. Special handling precautions are required. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E00222-PS CXG1090EN Block Diagram Pin Configuration RF4 (Ant/Ext.1) F1 9 F2 F4 6 4 F5 F7 F6 F8 8 RF3 (Tx) RF4 9 8 7 6 5 4 3 2 1 RF3 GND RF2 GND RF1 RF-GND1 CTLC CTLB GND 10 RF5 11 RF2 (Ant/Ext. 2) RF1 (Diversity 2) RF5 11 (Rx) RF6 13 (Diversity 1) F3 GND 12 RF6 13 RF-GND6 14 VDD 15 CTLA 16 14 RF-GND6 3 RF-GND1 Recommended Circuit RF4 L1 GND RF5 L1 GND 100pF 100pF 9 8 100pF L1 RF3 10 7 GND RF2 100pF L1 GND 11 6 12 5 RF6 L1 RF-GND6 100pF Z6 13 4 100pF L1 RF1 Z1 14 3 RF-GND1 CTLC 1k CTLB VDD 100pF CTLA 1k 100pF 15 2 100pF 16 1 100pF 1k DC blocking capacitors (CRF) are needed. Recommended to use bypass capacitors (Cbypass). Recommended to use control resistors (RCTL), when it is necessary to improve the electrostatic discharge strength (ESD). -2- CXG1090EN Truth Table Control CTLA H H L L L L CTLB L L L L H H CTLC L H L H L H ON RF3 RF2 RF3 RF4 RF5 RF2 RF5 RF4 RF5 RF6 RF5 RF1 F1 OFF ON ON OFF OFF OFF F2 ON OFF OFF ON OFF OFF F3 OFF ON ON OFF OFF OFF F4 ON OFF OFF ON OFF OFF F5 OFF OFF OFF OFF ON OFF F6 OFF OFF OFF OFF OFF ON F7 ON ON ON ON OFF ON F8 ON ON ON ON ON OFF DC Bias Condition Item VCTL (H) A to C VCTL (L) A to C VDD Min. 2.4 0 2.8 Typ. (Ta = 25C) Max. 3.6 0.8 3.2 Unit V V V -3- CXG1090EN Electrical Characteristics 1 Item Frequency Condition (VCTL (L) = 0V, VCTL (H) = 3V, Ta = 25C) Min. Typ. 0.32 0.30 0.55 0.55 0.5 0.5 17 17 17 17 31 24 19 21 21 19 38 29 1.4 Pin = 29.5dBm, VDD = 3.0V1 Pin = 29.5dBm, VDD = 2.8V1 Pin = 29.5dBm, VDD = 3.0V1 Pin = 29.5dBm, VDD = 2.8V1 Pin = 29.5dBm, VDD = 3.0V1 Pin = 29.5dBm, VDD = 2.8V1 Pin = 29.5dBm, VDD = 3.0V1 Pin = 29.5dBm, VDD = 2.8V1 -67 -67 -75 -75 -67 -67 -67 -67 85 VDD = 3.0V VDD = 2.8V 0.45 0.4 1.0 -57 -55 -65 -62 -60 -57 -60 -57 150 1 0.9 5.0 dBc dBc dBc dBc dBc dBc dBc dBc A mA mA s Max. 0.55 0.55 0.85 0.85 0.8 0.8 Unit dB dB dB dB dB dB dB dB dB dB dB dB RF3-RF2 889 to 960MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V RF3-RF4 889 to 960MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V Insertion loss RF5-RF2 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V RF5-RF4 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V RF5-RF1 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V RF5-RF6 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V RF3-RF2 889 to 960MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V RF3-RF4 889 to 960MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V Isolation RF5-RF2 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V RF5-RF4 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V RF5-RF1 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V RF5-RF6 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V VSWR ACP (50kHz) Each ON 810 to 960MHz Port RF3-RF2 RF3-RF4 ACP (100kHz) RF3-RF2 RF3-RF4 2nd harmonics RF3-RF2 RF3-RF4 3nd harmonics Control current Bias current Switching speed 1 Input signal: ACP (50kHz) < -65dBc, APC (100kHz) < -75dBc, 2nd harmonics < -65dBc, 3rd harmonics < -65dBc RF3-RF2 RF3-RF4 889 to 960MHz 889 to 960MHz 889 to 960MHz 889 to 960MHz -4- CXG1090EN Electrical Characteristics 2 Item Frequency Condition (VCTL (L) = 0V, VCTL (H) = 3V, Ta = 25C) Min. Typ. 0.40 0.40 0.65 0.65 0.60 0.60 12 15 15 13 35 20 15 18 18 16 40 25 1.4 Pin = 29.5dBm, VDD = 3.0V1 Pin = 29.5dBm, VDD = 2.8V1 Pin = 29.5dBm, VDD = 3.0V1 Pin = 29.5dBm, VDD = 2.8V1 Pin = 29.5dBm, VDD = 3.0V1 Pin = 29.5dBm, VDD = 2.8V1 Pin = 29.5dBm, VDD = 3.0V1 Pin = 29.5dBm, VDD = 2.8V1 -67 -67 -75 -75 -67 -67 -67 -67 85 VDD = 3.0V VDD = 2.8V 0.45 0.4 1.0 -55 -53 -65 -62 -60 -57 -57 -55 150 1 0.9 5.0 dBc dBc dBc dBc dBc dBc dBc dBc A mA mA s Max. 0.70 0.70 0.95 0.95 0.90 0.90 Unit dB dB dB dB dB dB dB dB dB dB dB dB RF3-RF2 1429 to 1453MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V RF3-RF4 1429 to 1453MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V Insertion loss RF5-RF2 1477 to 1501MHz Pin = 7dBm, VDD = 2.8 to 3.0V RF5-RF4 1477 to 1501MHz Pin = 7dBm, VDD = 2.8 to 3.0V RF5-RF1 1477 to 1501MHz Pin = 7dBm, VDD = 2.8 to 3.0V RF5-RF6 1477 to 1501MHz Pin = 7dBm, VDD = 2.8 to 3.0V RF3-RF2 1429 to 1453MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V RF3-RF4 1429 to 1453MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V Isolation RF5-RF2 1477 to 1501MHz Pin = 7dBm, VDD = 2.8 to 3.0V RF5-RF4 1477 to 1501MHz Pin = 7dBm, VDD = 2.8 to 3.0V RF5-RF1 1477 to 1501MHz Pin = 7dBm, VDD = 2.8 to 3.0V RF5-RF6 1477 to 1501MHz Pin = 7dBm, VDD = 2.8 to 3.0V VSWR ACP (50kHz) Each ON 1429 to 1501MHz Port RF3-RF2 RF3-RF4 ACP (100kHz) RF3-RF2 RF3-RF4 2nd harmonics RF3-RF2 RF3-RF4 3nd harmonics Control current Bias current Switching speed 1 Input signal: ACP (50kHz) < -65dBc, APC (100kHz) < -75dBc, 2nd harmonics < -65dBc, 3rd harmonics < -65dBc RF3-RF2 RF3-RF4 1429 to 1453MHz 1429 to 1453MHz 1429 to 1453MHz 1429 to 1453MHz -5- CXG1090EN Package Outline Unit: mm 16PIN VSON(PLASTIC) 0.9 MAX 0.6 3.5 A S 0.05 S 0.35 0.1 2.5 B 0.4 1.4 4x 0.2 S A B 2x 0.2 S B 0.35 0.1 Soldrer Plating 0.13 0.025 + 0.09 0.14 - 0.03 NOTE: 1) The dimensions of the terminal section apply to the ranges of 0.1mm and 0.25mm from the end of a terminal. TERMINAL SECTION PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE VSON-16P-01 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.02 g -6- 0.03 0.03 0.2 0.01 0.23 0.02 0.05 M S A-B 0.5 0.2 2.7 |
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